Advanced Materials Processing (AMP)
Lapmaster’s “systems approach” provides a complete line of processing wherewithal which includes machinery, accessories, consumables & services to process primary & secondary wafers, lenses and other components that comprise “Advanced Materials” Applications.
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More about Lapmaster's Advanced Materials Processing (AMP) products:
- Nanomat Lapping and Polishing Machinery
- Wafer Edge Grinding and Polishing Machinery
- Wafer Planarization Machinery
- Metrology Products
We are focused in serving these four major material/product groups:
- Semiconductor
- Compound Semiconductor
- Electro-Optics
- MEMS/NEMS
Developmental and commercial growth, especially concerning the Compound Semiconductor materials and various MEMS/NEMS applications, is present in three (3) distinct profiles. Lapmaster appreciates the unique needs of these individual endeavors :
- University R&D
- Government Labs
- Private Business
Lapmaster is aware of the individual requirements that each of the above developmental and processing centers mandate. Based on these separate needs, we have developed equipment, optional features and accessories to address those needs. However, there are three common goals that we always maintain during our product development:
- Constant Improvement of Device Quality
- Enhanced Yield & Productivity
- Reduced Cost per Device
Lapmaster’s initiative to address the needs of the Advanced Materials Applications developmental and growth centers can be summarized in five product-service categories:
Specialty Machinery
- Wafer Thinning Systems
- Back-Grinding Systems
- Lapping Systems
- Polishing Systems
- Planarization Systems
- Wafer Edge Grinder
- Wafer Edge Polisher
Accessory Items
- AccuPol Thinning Fixtures
- Slurry Pumping Systems & Heaters
- Motorized Roller Yokes
- Modular Power Modules
- Temperature Control Systems
- Single & Multi-Stage Wafer Rinsing, Cleaning & Drying Systems
- Wafer Mounting Tools and Films
- Wafer Transfer-Mounting Plates
- More about our Processing Accessory Items
Consumables
- Conventional Abrasives (powders & pre-mixed slurry)
- Diamond Slurry
- Colloidal Slurries
- Polishing and Planarization Pads
- Pad Conditioning Tooling
- Double-Sided Machine Carriers
- Custom-Formulated Processing Fluids and Lubricants
- Engineered Cleaning Agents
- Edge Grinding Wheels
- More about our Consumables
Metrology
- Profile Inspection System for Wafer Edge and Wafer Notch
- Both Contact and Non-Contact Laser Interferometers for Flatness Evaluation, both Systems Feature Grazing-Incidence Capability and Computer Analysis Option.
- More about Metrology Products
Contract Services
Lapmaster has the in-house equipment and an experienced staff capable of processing “Advanced Materials” on a contract basis, as well as providing process development services. Some of the services we offer:
- Back-Thinning
- Back-Grinding
- Lapping
- Polishing
- Planarization
- Metrology Inspection & Certification
- More about Contract Processing
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