Lapmaster International - US

   501 W. Algonquin Rd.
   Mount Prospect, Illinois 60056

   Toll Free 877-FLATNESS

   Phone 224.659.7101
   Fax 224.659.7103

 

Home > Metallographic Products > Abrasive Cut-Off Wheels & Diamond Wafering Blades

Abrasive Cut-Off Wheels & Diamond Wafering Blades

Abrasive cutting has proven to be one of the most effective method for sectioning materials for Metallographic sample preparation. The key to achieving quality sections is the selection of the proper abrasive Cut-Off Wheel. Choosing the right wheel not only ensures the easy of cutting the samples, but also saves time in subsequent grinding and polishing steps, because much less damage is introduced into the specimen.

Lapmaster offers a wide selection of abrasive Cut-Off Wheels engineered for a variety of materials and applications, however, by combining different abrasive types, sizes and bonds Lapmaster Cut-Off Wheels can be developed for virtually any application. To best help you decide which Cut-Off Wheel is best suited for your application, please visit our Cut-Off Wheel Chart.

For applications which require greater precision and thin sectioning capability, Lapmaster recommends diamond wafering blades. Diamond wafering blades should be used with a precision low speed wafering saw. Low concentration blades are suggested for hard brittle materials and ceramics, while high concentration blades are used with metallics. To best help you decide which Diamond Wafering Blade is best suited for your application, please visit our Diamond Wafering Blade Chart.

Lapmaster also offers a complete line of accessories for your cutoff applications from dressing sticks to cutting fluids.